Core-i

DM-1XXP/PM-3100

DM-1XXP/PM-3100
Modular Industrial Panel PC with Intel® Q370 9th / 8th Core™ i3 / i5 / i7 Processor
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Features
list_dot_01.png9th / 8th Gen Intel® Core™-i LGA 1151 Processors
list_dot_01.pngPatented Display Conversion Device (DCD) Technology
list_dot_01.pngIP65 True Flat Front Panel
list_dot_01.pngAluminum Die-casting Ultra-thin Bezel
list_dot_01.pngBuilt-in Power Protection (OVP / OCP / RVP)
list_dot_01.png9~48V DC Input with Power Ignition Function
Applications
list_dot_01.pngFactory Automation
list_dot_01.pngMotion Control
list_dot_01.pngMachine Vision
list_dot_01.pngProduction Line Automation
list_dot_01.pngDigital Surveillance

Display Modules

Model DM-115P DM-117P DM-119P DM-121PW DM-124PW
Panel Panel Size 15” 17" 19" 21.5" 24"
Panel Type LCD Panel
Aspect Ratio 4:3 5:4 5:4 16:9 16:9
Resolution XGA, 1024 x 768 SXGA, 1280 x 1024 SXGA, 1280 x 1024 FHD, 1920 x 1080 FHD, 1920 x 1080
Viewing Angle 176 (H) x 176 (V) 170 (H) x 170 (V) 170 (H) x 160 (V) 178 (H) x 178 (V) 178 (H) x 178 (V)
Brightness 350 cd/m2 350 cd/m2 350 cd/m2 300 cd/m2 300 cd/m2
Contrast Ratio 2500 : 1 800 : 1 1000 : 1 5000 : 1 5000 : 1
Color Support 16.2 M 16.7 M 16.7 M 16.7 M 16.7 M
Touchscreen Touchscreen Type Projected Capacitive
Surface Hardness 7 Mohs
Durability N/A
Transparency 90% (±3%)
Remote 1x Remote Power On/Off Connector, 2-pin Terminal Block 3.5mm
1x Remote OSD Connector
Speaker 2x 2W Internal Speakers
OSD Control Function Keys Touch Monitor On/Off, Auto, Menu, Up and Down, Multi-language OSD
Mounting Type Panel Mount / VESA Mount (100 x 100 mm) / Wall Mount (Optional)
Environment Operating Temperature -20°C to 70°C (-4~158° F) -20°C to 70°C (-4~158° F) -10°C~50°C (14~122° F) -10°C~60°C (14~140° F) -20°C to 70°C (-4~158° F)
Storage Temperature -30°C to 80°C (-22~176° F) -30°C to 80°C (-22~176° F) -20°C~60°C (-4~140° F) -20°C~70°C (-4~158° F) -30°C to 80°C (-22~176° F)
Humidity 10 ~ 80% (Non-condensing)
Vibration 1.5 Grms, 5-500 Hz, 3 Axis
Shock 20 Grms, Half-sine 11 ms
General Certication CE / FCC
Ingress Protection IP65 Compliant Front Panel
Material Front Panel Construction: Die-casting Flat Surface
Dimensions (W x H x D) 280.6 x 227.9 x 74.5mm
(11.05” x 8.97” x 2.93” )
407.3 x 338.7 x 77mm
(16.04” x 13.33” x 3.03”)
449.7 x 374.4 x 77 mm
(17.7” x 14.74” x 3.03”)
527 x 323 x 77 mm
(20.75” x 12.72” x 3.03”)
584 x 353 x 82 mm
(22.99” x 13.9”x 3.23”)
Net Weight 2.45 kg (5.40 Ib) 4.85 kg (10.69 Ib) 5.85 kg (12.89 Ib) 6.05 kg (13.33 Ib) 8.1 kg (17.85 Ib)

PC Module

Model PM-3100
Processor System CPU Supports 9th/ 8th Intel® Core™ i3 / i5 / i7 Desktop 35W LGA 1151 Processors
System Chipset Intel® Q370
BIOS  AMI BIOS, 64Mbit SPI Flash ROM Built on Board
Memory Technology 2x DDR4-2400/2666MHz 260-Pin SO-DIMM Socket
Max. Capacity Supports up to 64GB (Un-buered and Non-ECC)
Type Socket
Display HDMI N/A
DP 1x DP (4096 x 2160
VGA 1x VGA (1920 x 1200)
DVI 1x DVI-D (1920 x 1200)
I/O Interface USB 6x USB3.1 and 2x USB2.0
Serial Port 6x RS232/422/485 with Auto Flow Control, DB9
Ethernet 3x GbE (1x Intel® i219-LM, 2x Intel® i210-AT GbE, Supporting Wake-on-LAN and PXE)
Audio Line Out, Mic In (Phone Jack 3.5mm)
GPIO / DIO 8x Isolated DI and 8x Isolated DO Ports, 2x9-pin Terminal Block
Antenna Hole 10
Others External Switch 1x Power On/Off Button and 1x Remote Power On/Off Connector, 2-pin Terminal Block
1x AT/ATX Mode Switch
1x PC/Car Mode Switch
1x Clear CMOS Switch and 1x Removable CMOS Battery
Flexible I/O Window Slot 1
Storage 2.5" HDD / SSD 1x Removable 2.5" SATA HDD Bay and 1x Internal 2.5" SATA HDD Bay
M.2 N/A
mSATA 2x mSATA Sockets (Mux with 2x Mini-PCIe and 2x CFast)
CFast 2x CFast Sockets (Mux with 2x mSATA)
Expansion Mini PCIe  2x Full-size Mini-PCIe Sockets (Mux with mSATA) and 2x Full-size Mini-PCIe Sockets
M.2 N/A
PCI / PCIe N/A
SIM Holder 4 x SIM Sockets
Power Power Mode Supports Hardware AT, ATX Power Mode
Power Supply Voltage 9~48V DC Input
Power Connector Type 1x 3-pin Terminal Block Connector
Power Ignition Power Ignition Sensing
Power Adapter 1x Optional AC/DC 24V/5A, 120W Power Adapter or 1x Optional AC/DC 24V 9.25A, 220W Power Adapter
Protection Over Voltage Protection (OVP) up to 52V
Reverse Voltage Protection (RVP) up to -48V
Over Current Protection (OCP) 20A
Mounting Type VESA Mount (100mm x 100mm) / Wall Mount
Environment Operating Temperature 35W CPU: -40°C to 70°C (-40~158° F)
65W CPU: -40°C to 60°C (-40~140° F) (Optional external fan kit is required
Storage Temperature -40~80 (-40~176° F)
Humidity 10%~95% (Non-condensing)
Vibration 5 Grms, 5-500 Hz, 3 Axis
Shock 50 Grms, Half-sine 11 ms
General Certication CE/FCC
Thermal Dissipation 35W CPU Fanless System, 65W CPU Fan-based System
Ingress Protection N/A
Material Extruded Aluminum with Heavy Duty Metal
Dimensions (W x H x D) 241.5 x 73x 230 mm (9.51” x 2.87” x 9.06”
Net Weight 3.3 kg (7.27 Ib)
Operating System Windows 10 (IoT/Professional), Linux

Ordering Information

Part No. Description
DM-115P/PM-3100 15" 4:3 (1024 x 768), 350 nits, Fanless Panel PC with Intel® 9th/8th Gen. Core™ i LGA1151 Processor, Projected Capacitive Touch, 6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 1x DP, 1x VGA, 1x DVI-D, Line Out, Mic In, DC 9~48V, Phoenix Connector
DM-117P/PM-3100 17" 5:4 (1280 x 1024), 350 nits, Fanless Panel PC with Intel® 9th/8th Gen. Core™ i LGA1151 Processor, Projected Capacitive Touch, 6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 1x DP, 1x VGA, 1x DVI-D, Line Out, Mic In, DC 9~48V, Phoenix Connector
DM-119P/PM-3100 19" 5:4 (1280 x 1024), 350 nits, Fanless Panel PC with Intel® 9th/8th Gen. Core™ i LGA1151 Processor, Projected Capacitive Touch, 6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 1x DP, 1x VGA, 1x DVI-D, Line Out, Mic In, DC 9~48V, Phoenix Connector
DM-121PW/PM-3100 21.5" 16:9 (1920 x 1080 ), 300 nits, Fanless Panel PC with Intel® 9th/8th Gen. Core™ i LGA1151 Processor, Projected Capacitive Touch, 6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 1x DP, 1x VGA, 1x DVI-D, Line Out, Mic In, DC 9~48V, Phoenix Connector
DM-124PW/PM-3100 24" 16:9 (1920 x 1080), 300 nits, Fanless Panel PC with Intel® 9th/8th Gen. Core™ i LGA1151 Processor, Projected Capacitive Touch, 6x USB3.2 Gen 2×2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 1x DP, 1x VGA, 1x DVI-D, Line Out, Mic In, DC 9~48V, Phoenix Connecto

Packing List

Description
1x  DM-1XXP(W)/PM-3100
Panel Mount Kits
Screw Pack

Optional Items

Part No. Description
AWD-4G003 4G(LTE) EG25-G + 2 Antennas, Full Size (For Global)
AWD-WF001 Wi-Fi 802.11 bgn (1T1R) + 1 Antenna (Single Band), Half-size miniPCIe
AWD-WF003 Wi-Fi 802.11 a/b/g/n/ac/BT4.0 (2T2R) + 2 Antennas (Dual Band), Half-size mini PCIe
i7-9700TE Intel® Core™ i7-9700TE (8-core, up to 3.8 GHz, 35W TDP)
i5-9500TE Intel® Core™ i5-9500TE (6-core, up to 3.6 GHz, 35W TDP)
i7-8700T Intel® Core™ i7-8700T (6-core ,up to 4.0 GHz, 35W TDP)
i5-8500T Intel® Core™ i5-8500T (6-core, up to 3.5 GHz, 35W TDP)
i3-8100T Intel® Core™ i3-8100T (4-core, up to 3.1 GHz, 35W TDP)
External Fan External Fan Module Kit (92 x 92 x 25 mm) (for 65W CPU Option)
55000-0023-M5 Adapter AC/DC 24V 5A 120W, 3-pin Terminal Block Plug 5.0mm Pitch
55000-0024-M5 Adapter AC/DC 24V 9.2A 220W, 3-pin Terminal Block Plug 5.0mm Pitch
30100-0003-CA Power Cord, 3-pin US Type, 180cm
30101-0005-CA Power Cord, 3-pin EU Type, 180 cm
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